1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions.
2.Design and qualify new process modules and RF device structures to enhance platform capability and performance.
3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications.
4.Collaborate closely with customers on new product verification, process customization, and technical alignment.
5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

We’re looking for someone with:
1.A Bachelor’s, Master’s, or PhD in Electrical Engineering, Electronics, or Physics.
2.Experience in semiconductor process integration, ideally with a focus on RF device or RFSOI development.
3.Strong skills in device characterization, process qualification, and integration debugging.
4.Knowledge of module development and semiconductor tooling is an advantage.
5.Excellent communication skills with the ability to collaborate effectively across teams and with customers.
6.A self-motivated, detail-oriented mindset with a passion for learning and continuous improvement.