1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms.
2.Lead the development and qualification of new unit modules and device structures.
3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms.
4.Collaborate directly with customers on product requirements, verification testing, and technical solutions.
5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

We’re looking for someone with:
1.A bachelor’s degree or higher in Microelectronics, Electrical Engineering, Physics, Materials Engineering, or a related field.
2.At least 7 years of experience in semiconductor R&D, process integration, or device engineering in a foundry is preferred.
3.Experience with advanced packaging platforms, including 2.5D and 3DIC technologies is a strong plus.
4.Proficiency in semiconductor device physics, integration methodologies, and device characterization.
5.Expertise in DOE, control planning, and FMEA for process and quality optimization.
6.Strong communication skills with the ability to collaborate effectively across functions.
7.A self-motivated, data-driven mindset with a passion for technology innovation.