1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.
2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows.
3.Align device and process requirements with customers through technical discussions and solution deep dives.
4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration.
5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases.

We’re looking for someone with:
1.A bachelor’s degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or a related field.
2.At least 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process integration, or related areas.
3.A strong background in SiPh process development, photonic IC packaging, optical device design, or characterization.
4.Familiarity with foundry environments, including integration or module-level responsibilities.
5.Proficiency in DOE, FMEA, control planning, and data-driven problem-solving.
6.Excellent communication skills with the ability to collaborate effectively across teams and with external partners.
7.A self-driven, curious mindset with a passion for innovation and continuous improvement.